WebEasyDUAL モジュールの FF11MR12W1M1_B70 と FF6MR12W2M1_B70 は、信頼性の高い優れたゲー ト酸化膜を採用した最新の CoolSiC MOSFET 技術を搭載しています。 さらに DCB 材料の熱伝導性の向 上により、ヒートシンクへの熱抵抗(RthJH)を最大で 40%低減します。 新しい AIN セラミックデバイスは、 CoolSiC Easy モジュールと組み合わ … WebJoin ArrowPerks and save $50 off $300+ order with code PERKS50
Infineon upgraded its EasyDUAL CoolSiC MOSFET Power Modules
WebCopyright 2024 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, Wolfspeed, and the Wolfspeed ... WebEasyDUAL 모듈 FF11MR12W1M1_B70 및 FF6MR12W2M1_B70에는 최신 CoolSiC가 장착되어 있습니다. 이끼 뛰어난 게이트 산화막 신뢰성을 특징으로하는 기술. DCB 재료의 향상된 열전도율로 방열판에 대한 열 저항 (R thJH)는 최대 40 %까지 낮출 수 있습니다. blon rapero
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WebThe EasyDUAL modules FF11MR12W1M1_B70 and FF6MR12W2M1_B70 are equipped with the latest CoolSiC MOSFET technology that features superior gate-oxide reliability. With the improved thermal conductivity of the DCB material, the thermal resistance to the heat sink (R thJH) can be lowered by up to 40 percent. WebApr 23, 2024 · Features – Easy 1B, 2B module packages – 1200 V CoolSiC™ trench MOSFET – Half-bridge configuration – High performance aluminum nitride ceramic – PressFIT technology Benefits – Easy design-in – High degree of freedom for the inverter designer – Better thermal conductivity of the DCB material – Superior gate-oxide reliability WebJun 8, 2024 · MUNICH – Infineon Technologies AG in Munich is introducing upgraded FF11MR12W1M1_B70 and FF6MR12W2M1_B70 EasyDUAL CoolSiC high-performance MOSFET ceramic modules with an aluminum nitride (AIN)... blonsh